At Microelectronics Island, you can expect short presentations on sustainability, autonomous systems, artificial intelligence, microelectronics/testing, analysis and metrology that are as exciting as they are varied. These short impulses are the starting point for further exchange and networking among the experts present. Around the island you will also find exhibitors with strong connections and relationships to the semiconductor manufacturing ecosystem.
CONNECT with people from all kinds of organization from scientific to manufacturing background, each a strong innovator, developer, decision maker or other like minded. The potential EXCHANGEs are manyfold and GROWth in several ways likely.
Agenda
Focus on Sustainability
11:00 - 11:10
How to use compressed air efficiently
Oliver Prang, SMC Deutschland GmbH
11:10 - 11:15
Energy and resource efficient wetbenches for greener manufacturing
Florian Kuhl, MK Versuchsanlagen und Laborbedarf e.K.
11:15 - 11:20
The Road to a Zero-Emission Sub-Fab
Dr. Guy Davies, DAS Environmental Expert GmbH
11:20 - 11:25
Green hydrogen solutions for semiconductor fabrication
Anton Hoffmann, Hynamics Deutschland GmbH
11:25 - 11:40
Questions and Answers
Focus on Autonomous Systems and Microelectronics
11:40 - 11:45
Heimdall project: #Part 2 - Significance for the semiconductor industry
11:45 - 11:50
Safe Communication Technology for Automated Systems
Benjamin Weinhardt, Siliconally GmbH
11:50 - 11:55
Silicon Austria Labs - Austria's Top Research Center for Electronic Based Systems
Dr. Julian Pilz, Silicon Austria Labs
11:55 - 12:00
FSI Smart Cell-The Most advanced FSI Mercury automation solution
Philippe Baldet, ATG Technologies
12:00 - 12:05
Introduction of GaN/BelGaN/GaNValley
Marnix Tack , BelGaN
12:05 - 12:20
Questions and Answers
Focus on Microelectronics and Artificial Intelligence
15:30 - 15:40
MBE-grown GaN-on-Si HEMTs show remarkable results at 40 GHz, an opportunity for mmWaves mobile applications.
Andre Bonnardot, EASYGAN
15:40 - 15:45
Microelectronics development for quantum communication systems
Dr. Kay-Uwe Giering, Fraunhofer IIS/EAS
15:45 - 15:50
Affordable Edge AI Mixed Signal IC with RISC V core
Stefan Schubert, Productivity Engineering GmbH
15:50 - 15:55
AI based image classification in production environments - strategies & challenges
Michael Meinel, convanit GmbH & Co. KG
15:55 - 16:10
Questions and Answers
Focus on Test, Metrology and Analysis
16:10 - 16:15
Bringing the leading edge in etching end-point detection
Maximilian Rothenberger, Spacetek Technology AG
16:15 - 16:20
New opportunities for quality assurance through hyperspectral vision
Dr. Wulf Grählert, DIVE GmbH
16:20 - 16:25
High-resolution 3D-imaging for inline wafer inspection using a novel x-ray tomography technique
Dr. Ronny Timmreck, deepXscan
16:25 - 16:30
European Functional package and assembly solutions
Oliver Maiwald, Sencio B.V.
16:30 - 16:35
IC measurement technology for EMC and Security
Konstantin Uhle-Wettler, Langer EMV-Technik GmbH
16:35 - 16:50
Questions and Answers
