Speaker

Optimization of energy efficiency and CO2 footprint in semiconductor subfabs

The abstract presents the goals and solutions implemented at Robert Bosch Semiconductor Manufacturing GmbH towards achieving a fully connected and automated factory through the introduction of ATC (Active Tool Coupling).
In partnership with DAS Environmental Expert GmbH, an expert in exhaust gas disposal systems with a shared vision of digitalization and reducing the CO2 footprint in the semiconductor industry, ATC was successfully launched.
ATC, a key component of smart manufacturing, optimizes energy usage and minimizes emissions like NOx and CO2 through software-based integration. While existing dry-contact solutions offer cost-saving opportunities, further optimization is possible by leveraging software interfaces and process data from existing hardware and subfab equipment. This enhances energy efficiency, reduces harmful emissions, lowers water consumption, and cuts overall costs.
ATC utilizes factory data, process tool and subfab equipment information to improve abatement efficiency, resulting in reduced usage of natural gas, oxygen, and water, as well as decreased wastewater generation. Its software-driven approach enables precise gas consumption tailored to demand rather than fixed settings.
Unlike current solutions, ATC employs an application-driven IT data integration architecture that connects process tools and subfab units based on the SEMI E175 standard. This enables improvements beyond current technology and, in addition, monitoring media consumption and sensor signals from subfab equipments provides semiconductor manufacturers with greater transparency regarding costs and future planning.