Speaker

Next Generation 3D Hetero Integration – Leading Edge Research Made in Saxony

15 years ago, Fraunhofer established a leading-edge R&D center for 3D integration and advanced wafer-level packaging on 200/300mm wafer sizes. The Center “All Silicon System Integration Dresden - ASSID” was founded directly in the heart of Silicon Saxony. It was the first 300mm R&D facility for this purpose in Germany.