Speaker

Human-AI Collaboration for Accelerated Insights: Root Cause Analysis of Yield Spatial Signatures

Can AI accelerate the discovery of the root cause behind complex yield issues, turning days of analysis into minutes? Absolutely! In this session, we’ll explore how semiconductor experts can leverage seamless human-AI collaboration to tackle yield challenges. We’ll demonstrate how modern Visual Data Science uses AI-driven techniques to amplify engineering expertise and creativity. A practical example will show how correlating sort bin yield signatures with process equipment can quickly identify root causes. Join us to learn how integrating human-in-the-loop data science can transform problem-solving and speed up decision-making in the fab.