Robert HillingerKistler Instrumente AG
Dynamic force measurement: Quality improvement in semiconductor production processes
The advancements in semiconductor technology put additional pressure on monitoring and controlling Semiconductor manufacturing processes. The optimization of processes is a pre-condition for high reliability which is achieved by selecting appropriate materials and controlling critical process parameters. Currently chip test, monitoring and control of packaging processes is widely done via optical-, displacement Sensors and Electrical Testing.
The physical force quantity causing a device failure may not be accessible to conventional measuring methods but is equally important to control and monitor production processes such as grinding, CMP, polishing, lamination, bonding, pick and place encapsulation and electrical testing.
Piezo dynamic force measurement technology allows force to be monitored and controlled with high resolution even at low forces. As a result, deviations can be detected early, errors avoided, and Semiconductor Advanced Packaging Equipment builders can achieve higher and more accurate machine performance. Semiconductor Manufacturing-Packing companies in the semiconductor industry benefit from higher process visibility, performance, lower quality cost and traceability of process data.