Dr. Germar SchneiderSenior Specialist Thin Wafer Handling Infineon Technologies Dresden
Dr. Germar Schneider
Chances, Challenges & Success Factors of Digitization
The semiconductor industry is one of the most complex industries due to the increasing requirements regarding different technologies and the high-mix product portfolios. Most of today’s 300mm fabs are following Moore’s Law which requires highest efforts on fast and secure ramp up and stable yields of the products. Other fabs follow the More-than-Moore strategy, like Infineon Technologies Dresden GmbH, facing the challenge of developing manifold products with very short life cycles simultaneously in a very short time period. Their product portfolio is evermore growing. In both cases semiconductor manufacturers must keep up with their competitors and market demands by improving the effectiveness and efficiency of development and production. Next to the development of the 200mm line with more than 200 different products the worldwide first 300mm line for power semiconductors with a very high product mix was established and is currently in a steep ramp up process. To meet the challenges of high product complexity, highest demand on production stability during a fast ramp up, fab automation and digitalization are the key elements.