3267

Special

Focus on Test, Metrology and Analysis

Focus on Test, Metrology and Analysis

Agenda

16:10 - 16:15
Bringing the leading edge in etching end-point detection
Dr. Federico Binda, Spacetek Technology AG

16:15 - 16:20
New opportunities for quality assurance through hyperspectral vision
Dr. Wulf Grählert, DIVE GmbH

16:20 - 16:25
High-resolution 3D-imaging for inline wafer inspection using a novel x-ray tomography technique
Dr. Ronny Timmreck, deepXscan

16:25 - 16:30
European Functional package and assembly solutions
Steffen Kroehnert, Sencio B.V.

16:30 - 16:35
IC measurement technology for EMC and Security
Konstantin Uhle-Wettler, Langer EMV-Technik GmbH

16:35 - 16:50
Questions and Answers

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