Agenda
Session Chair: Dr. Peter Schneider | Fraunhofer IIS/EAS
16:10 - 16:15
Bringing the leading edge in etching end-point detection
Dr. Federico Binda, Spacetek Technology AG
16:15 - 16:20
New opportunities for quality assurance through hyperspectral vision
Dr. Philipp Wollmann, DIVE GmbH
16:20 - 16:25
High-resolution 3D-imaging for inline wafer inspection using a novel x-ray tomography technique
Dr. Ronny Timmreck, deepXscan
16:25 - 16:30
European Functional package and assembly solutions
Steffen Kröhnert, Sencio B.V.
16:30 - 16:35
IC measurement technology for EMC and Security
Konstantin Uhle-Wettler, Langer EMV-Technik GmbH
16:35 - 16:50
Questions and Answers