Speaker

High-resolution 3D-imaging for inline wafer inspection using a novel x-ray tomography technique

We are presenting a novel x-ray tomography technique that is able to capture 3D images of a multi mm thick advanced packaged wafer at high speed. With our disruptive x-ray optics it is possible to penetrate very thick wafers and reaching high resolution at the same time. We show applications in at-line as well as in-line wafer inspection to identify defects and consequently optimizing the process to increase yields.